H. Guo, W. Zhang*, M.W. Chen, Y. Saotome, M. Fukuhara and A. Inoue,  Metall. Mater. Trans. A, 42(2011) 1486-1490.

Abstract

The thermal stability, glass-forming ability (GFA), and mechanical and electrical properties of Au-based Au x Si17Cu75.5–x Ag7.5 (x = 40 to 75.5 at. pct) metallic glasses were investigated. The glass transition temperature (T g ) and crystallization temperature (T x ) decreased with increasing Au content. The ultralow T g values below 373 K (100 °C) were obtained for alloys with x = 55 to 75.5. The alloys with x = 45 to 70 exhibited a high stabilization of supercooled liquid and a high GFA, and the supercooled liquid region and critical sample diameter for glass formation were in the range of 31 K to 50 K and 2 to 5 mm, respectively. The compressive fracture strength (σ c,f ), Young’s modulus (E), and Vicker’s hardness (H v ) of the bulk metallic glasses (BMGs) decreased with increasing Au content. A linear correlation between Au concentration and the characteristic temperature, i.e., T g and T x , and mechanical properties, i.e., σ c,f , E, and H v , as well as electrical resistivity can be found in the BMGs, which will be helpful for the composition design of the desirable Au-based BMGs with tunable physical properties.

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